The Hong Kong Electronics Fair 2026 (Autumn Edition), a globally acclaimed electronics exhibition, was held in grand style at the Hong Kong Convention and Exhibition Centre (HKCEC) from 13 to 16 October 2026. As a leading provider of automotive electronics and embedded semiconductor solutions, Intron Technology showcased two core technology achievements at the Future Microelectronics exhibition zone; meanwhile, Mr. Sam Qin, Chief Technology Officer of the Company, was specially invited to participate in a round-table discussion at the summit forum of Future MicroE, engaging with global industry leaders and experts whilst analysing the emerging trends in the microelectronics sector.
*Mr. Sam Qin, Chief Technology Officer of Intron Technology (first from the left), alongside representatives including Ms. Sophia Chong, Executive Director of the Hong Kong Trade Development Council (fifth from the left), and Mr. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of the Government of the Hong Kong Special Administrative Region (fourth from the right), posing for a group photograph
Panel Discussion: Ecological Synergy Propelling Technology from Conception to Industrial Implementation
At the 'Future MicroE' summit forum held during the exhibition, Mr. Sam Qin, Chief Technology Officer of Intron Technology (first from the right in the photo below), was invited to participate in an in-depth panel discussion alongside industry pioneers on the theme of 'Making Innovation Real: Advanced Manufacturing, Smart Products and Global Scale.'
“The key for enterprises to cope with supply chain volatility lies in building vertical integration and forward-looking R&D capabilities spanning from the underlying semiconductor layer to the end-user system level. By establishing a complete value chain—from advanced chip packaging, thermal management and system architecture through to large-scale mass production—enterprises can achieve rapid substitution and engineering validation even in extreme scenarios where core components are in short supply, thereby effectively reducing reliance on external single points of failure.” At the same time, Mr Sam Qin emphasised that Hong Kong, as a two-way industrial hub connecting the mainland’s manufacturing hinterland with cutting-edge international markets, leverages top-tier innovation and technology ecosystems such as the Hong Kong Science Park to provide an irreplaceable fulcrum for driving collaborative innovation across the entire industrial chain and accelerating the global expansion of high-value-added technological achievements.
Booth Spotlight: Two Core Technical Solutions Illustrate 'Electrification and Intelligence'
At this exhibition, Intron Technology closely centred its presentation on the two cutting-edge future trends of 'Electrification × Intelligence', physically showcasing high-barrier, cutting-edge microelectronics product solutions: the Embedded Power Module and the High-Integration COB 3D Perception Module.
Targeting the electrification sector, the Embedded Power Module delivers exceptional thermal management efficiency and ultra-high power density within an extremely compact form factor, providing a miniaturised microelectronic hardware foundation with higher reliability and greater integration for the next generation of new energy vehicle electric drive and high-voltage electronic control systems, thereby supporting the development of an intelligent electrification ecosystem; Positioned for the intelligent technology sector, the High-Integration COB 3D Perception Module demonstrated high-precision 3D depth point-cloud imaging and real-time spatial perception capabilitieson-site, breaking through the boundaries of traditional visual perception and enabling embodied intelligence and terminal application innovations to interact precisely in dynamic scenarios.
Distinguished Guests in Attendance: Deepening Collaboration between Government, Business and Academia, and Charting a Course for Commercial Scaling
Throughout the exhibition, Intron Technology’s booth garnered widespread attention thanks to its cutting-edge displays and hands-on demonstrations, welcoming global ecosystem partners, professional buyer delegations and leading technology media outlets from both home and abroad to stop by and engage in discussions. Distinguished guests from government and business delegations, including Professor Sun Dong, Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region Government; Mr. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region Government; Ms. Sophia Chong, Executive Director of the Hong Kong Trade Development Council; and Mr. Xie Changlin, Member of the Standing Committee of the Tianhe District Committee of Guangzhou, visited the booth to extend their insights. The various parties engaged in fruitful discussions centred on cross-border collaboration within the microelectronics industry, independent breakthroughs in core technologies, and the large-scale commercialisation and implementation of these innovations.
*Mr. James Ng, Chief Financial Officer of Intron Technology (eighth from the left), alongside Professor Sun Dong, Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region Government (ninth from the left), Ms. Sophia Chong, Executive Director of the Hong Kong Trade Development Council (fifth from the right); and other representatives, posing for a group photograph
The successful completion of the exhibition marks a new chapter for Intron Technology as it expands its in-depth industry collaboration. Looking ahead, Intron Technology will continue to cultivate strategic emerging sectors such as intelligent mobility and humanoid intelligent robotics, championing technological innovation whilst fostering an open ecosystem, and join hands with global industry chain partners to explore the boundless possibilities of microelectronics technology!
